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BEGIN:VEVENT
DTSTART:20230622T180000Z
DTEND:20230622T200000Z
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SUMMARY:HPCC Technology Seminar Series
DESCRIPTION:Innovations in Technology: Leverage your 3D software into 3D Printing and Scanning
X-ALT-DESC;FMTTYPE=text/html:Innovations in Technology: Leverage your 3D software into 3D Printing and Scanning
LOCATION:The Study at The University of Chicago Drafting I
UID:e.1800.574
SEQUENCE:3
DTSTAMP:20260427T200430Z
URL:http://hydeparkchamberchicago.chambermaster.com/events/details/hpcc-technology-seminar-series-574
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